Yield estimator

Chip Sense / Tools / Yield estimator

Estimates only. These tools are illustrative what-if calculators for teaching and writing — not forecasts, quotes, fab plans, or legal/compliance advice. Defaults are curated teaching values; replace them with your own inputs.

Poisson or Murphy die-yield models plus a simplified dies-per-wafer geometry. Teaching tool — not a foundry yield report.

Methodology

How to use

Review Assumptions on the left. Amber badges are teaching estimates; they become Your input when you edit.
Leave teaching defaults as-is, or set die area and defect density for your scenario.
Optionally switch Poisson ↔ Murphy to compare yield models.
Read die yield, dies per wafer, and good dies on the right — plus the sensitivity table.
Read Estimated results on the right (~ means estimate). Use Reset or Methodology anytime.

Assumptions

Edit any field — values you change are treated as your input, not Chip Sense published facts.

Yield modelEstimate

Poisson is the teaching default; Murphy is an alternate clustered-defect model.

Die areaEstimatecm²Teaching default for a large logic / AI accelerator die (~800 mm²). Replace with your die size.Defect density (D0)Estimatedefects/cm²Illustrative advanced-logic defect-density band mid-point. Real D0 is process- and foundry-specific.Wafer diameterEstimatemmIndustry-standard 300 mm wafer.Edge exclusionEstimatemmTypical teaching edge exclusion (~3 mm).

Estimated results

Outputs use ~ / ranges on purpose. Basis: your current assumptions.

Die yield

Estimate

~30.1%

Using Poisson Y = e^(−A·D).

Dies per wafer (geometry)

Estimate

~84.9dies

Usable wafer area ÷ die area (edge exclusion applied). Ignores scribe/reticle packing.

Good dies per wafer

Estimate

~25.6dies

DPW × yield under current assumptions.

Sensitivity (defect density)

D0 −20%~38.3% · ~32.5 good dies
Baseline D0~30.1% · ~25.6 good dies
D0 +20%~23.7% · ~20.1 good dies