Chip Sense / Tools / Packaging cost model
Estimates only. These tools are illustrative what-if calculators for teaching and writing — not forecasts, quotes, fab plans, or legal/compliance advice. Defaults are curated teaching values; replace them with your own inputs.
Packaging cost model
Coarse $/unit build-up for advanced packaging teaching stories (substrate + assembly + test, inflated by package yield). Not an OSAT quote.
How to use
- Review Assumptions on the left. Amber badges are teaching estimates; they become Your input when you edit.
- Set batch size and the three cost legs (substrate, assembly, test).
- Tune package yield to see how scrap inflates effective unit cost.
- Compare your result to the illustrative CoWoS-class sanity band in the results panel.
- Read Estimated results on the right (~ means estimate). Use Reset or Methodology anytime.
Assumptions
Edit any field — values you change are treated as your input, not Chip Sense published facts.
Estimated results
Outputs use ~ / ranges on purpose. Basis: your current assumptions.
Unit cost (before yield loss)
Estimate~$750
Substrate + assembly + test.
Unit cost (with package yield)
Estimate~$815
Base ÷ package yield (~92.0%).
Batch total
Estimate~$8.15M
10,000 units × yield-adjusted unit cost.
Implied yield-loss cost
Estimate~$652.2k
Extra spend attributed to package yield below 100%.
Illustrative public “CoWoS-class” band used to sanity-check defaults: ~$500 – $2.0k per AI GPU package (wide trade-press range; estimate only). Illustrative CoWoS-class cost bands synthesized from public trade-press ranges — not OSAT quotes.